SFP 1X4 Enclosure Spring Finger Pressfit Connector

SFP 1X4 Enclosure Spring Finger Pressfit Connector

Short Description:

Small Form-factor Pluggable(SFP) System-SFP with Enhanced EMI Gaskets 1X4

As data rates exceed 2.5Gb/s, there is a greater need for higher MEI suppression. Enhanc
EMI gaskets are added to the existing SFP product line to meet the increased EMI requirements at
higher data rates. The SFP cages with enhanced EMI Gaskets are compat with the existing SFP MSA
panel cutout. The enhanced EMI Gaskets offer increased surfa area for improved EMI suppression. EMI
gaskets are double sided to reduce emissions between both cage and panel, as well as cage and
module. Testing suggests a 20dB improvement on EMI suppression can be achieved.

Product Facts: RoHS Compliant
Offers full metal housing for superior grounding and EMI suppression

Solder,SMT,and Press Fit configurations available

Connector supports  data rates  beyond 10Gb/s

Chassis grounds for pass through  EMI protection to  12.5Gb/s

SFP+  Standards:     SFF-8432, SFF-8083  and SFF-8431

Product Detail

Product Tags

Technical Parameters:

  • General Characteristics
    ROHS compliant
    Industry standard footprint
    Industry standard EIA-364
  • Mechanical Characteristics
    Accepts mutiple transceivers per INF-8074i
    Compliant press-fit pins or solder tails (for 1×1 cages)
    Durability: 250 mating cycles min
  • Electrical Characteristics
    Hot swappable
    Operating voltage: 3.3V
    Operating current: 0.5A
    Differential impedance: 100Ω±10Ω
    DWV: 300V AC
    Insulation resistance: 1000MΩ min
    Contact resistance: 70MΩ max
  • Packaging
    Tape and reel packaging: cage or connector
    Tray packing: cage of all sizes
    Outer packing: carton, dust cover, backing board, drier
  • Temperature rating
    Operating temperature: -55℃~+85℃
    Storage temperature: -55℃~+105℃
  • Materials
    Base Material: Copper Alloy
    Plating: Nickel or Tin
    Heat sink: Aluminum Alloy
    Heat sink clip: Stainless Steel
    Light pipe: Optical grade polycarbonate
    Dust cover: Thermoplastic
    Contact base material: Copper Alloy
    Contact plating: Gold on mating area, matte tin on termination
    Housings: Glass reinforced, Lead-free solder reflow process compatible thermoplastic, UL94V-0 Rated
  • Configurations 1xN (rows x ports per row)
    1×1  1×2  1×4  1×6
  • Options
    Dust cover
    Round light pipe
    Heat sink
    EMI shielding
  • D3






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